Heat dissipating module, heat dissipating system and circuit module
US9953896B2 · kind B2 · utility
2Cited by
11References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2016 |
| Grant date | Apr 24, 2018 |
| Priority date | — |
| Expiry date | May 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present application provides a heat dissipating module, a heat dissipating system and a circuit module. The heat dissipating module adapted to be used with a heat element. The heat dissipating module comprises a heat exchanger which has a heat exchanging zone contacted with the heat element; a securing structure; and a fluid driving unit which is communicated with the heat exchanger for guiding a working fluid into the heat exchanger and is secured to the heat exchanger by the securing structure, wherein the fluid driving unit and the second heat exchanger are separately installed and communicated with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.