Patent · US Active

Fluid-filled microchannels

US9953897B2 · kind B2 · utility

1Cited by

3References

21Claims

0Family size

Assignee

Hewlett Packard Enterprise Development LP · US

Inventors

Niru Kumari · Palo Alto, US
Sergio Escobar-Vargas · Palo Alto, US

Key dates

Filing date	Jul 22, 2016
Grant date	Apr 24, 2018
Priority date	—
Expiry date	Jul 22, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/3738
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device comprises a first layer of a die. The first layer comprises a microchannel. The microchannel is partially filled with a liquid and partially filled with air. The die also comprises a second layer. The second layer of the die seals a top of the microchannel of the first layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.