3-D stacking of active devices over passive devices

US9955582B2 · kind B2 · utility

Assignee

• Skyworks Solutions, Inc. · US

Inventors

• Mark A. Kuhlman · Laguna Niguel, US
• Anthony James LoBianco · Irvine, US
• Thomas E. Noll · Derry, US
• Robert W. Warren · Newport Beach, US
• Howard E. Chen · San Jose, US

Key dates

• Filing date: Apr 23, 2008
• Grant date: Apr 24, 2018
• Expiry date: Apr 23, 2028

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Single-die or multi-die packaged modules that incorporate three-dimensional integration of active devices with discrete passive devices to create a package structure that allows active devices (such as, silicon or gallium-arsenide devices) to share the same footprint area as an array of passive surface mount components. In one example, a module includes at least one active device stacked on top of an array of passive surface mount components on a substrate. A conductive or non-conductive adhesive can be used to adhere the active device to the array of passive devices.