Thin film for a lead for brain applications
US9956396B2 · kind B2 · utility
33Cited by
8References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2013 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Feb 8, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1322
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A thin film for a lead for brain applications includes at least one section comprising a high conductive metal and a low conductive metal, whereby the low conductive metal is a biocompatible metal and has a lower electrical conductivity than the high conductive metal and whereby the high conductive metal is at least partially encapsulated by the low conductive metal. Furthermore, the present invention relates to a method of manufacturing a thin film for a lead for brain applications and a deep brain stimulation system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.