Cutting element and a method of manufacturing a cutting element
US9956666B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2014 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | May 19, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22F2005/001
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A cutting element includes a substrate and a cutting layer disposed on a surface of the substrate. The cutting layer includes an ultra hard material. The substrate includes tungsten carbide and a metal binder. The substrate has a magnetic saturation value in the range of from 80 to less than 85%. In another aspect, the magnetic saturation value may increase within the substrate along a gradient, wherein proximal to the interface with the cutting layer, the substrate has a magnetic saturation value in the range of from 80 to less than 85%. Drill bits incorporating such cutting elements and methods of manufacturing such cutting elements are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.