Polishing pad and polishing method
US9956669B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 27, 2014 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Dec 9, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a polishing pad including a polishing member having a polishing surface, wherein the polishing member contains a material having dilatancy characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.