Patent · US Active

Micromechanical pressure sensor

US9957158B2 · kind B2 · utility

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1References

1Claims

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Assignee

Robert Bosch GmbH · DE

Inventors

Florian Grabmaier · Rötteln, DE
Eckart Schellkes · Kirchentellinsfurt, DE
Timo Lindemann · Reutlingen, DE

Key dates

Filing date	Jan 3, 2017
Grant date	May 1, 2018
Priority date	—
Expiry date	Jan 3, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/0792
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for producing a pressure sensor comprises providing a substrate with a depression; attaching a micromechanical sensor element to the substrate in the depression; attaching an evaluation circuit to the substrate next to the depression; electrically connecting the evaluation circuit to the sensor element; covering the substrate around the depression by means of a potting die such that the depression is closed; potting the evaluation circuit between the substrate and the potting die; and removing the potting die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.