Resin composition, prepreg, and film
US9957349B2 · kind B2 · utility
0Cited by
6References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2013 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Dec 13, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K77/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition for transparent substrates comprises an epoxy resin (A) and a curing agent (B), wherein the curing agent (B) comprises a cyclohexane tricarboxylic anhydride.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.