Low thermally conductive spacer for hot and cold feedline insulation
US9958105B1 · kind B1 · utility
4Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2015 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Dec 7, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/32
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A multilayer insulation is provided that includes radiant barrier layers separated by one or more spacers. The spacers are configured to maintain separation and provide a low conductivity thermal path between adjacent radiant barrier layers of the multilayer insulation. In certain implementations, the spacers have a shape defined by the intersection of three orthogonally oriented discs and are disposed between two radiant barrier layers of the multilayer insulation. In other implementations, the spacers are mechanically coupled to and extend from a radiant barrier layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.