Complex three-dimensional multi-layer structure and manufacturing method thereof
US9958581B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2013 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | May 8, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24612
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention relates to a 3-dimensional complex multilayer structure. The 3-dimensional complex multilayer structure includes a first pattern and a second pattern having different thicknesses formed on one or both surfaces of a plate. The first pattern is selected from the group consisting of parallel lines, parallel curves, parallel zigzag lines, and combinations thereof which do not meet each other. The second pattern is not parallel to the first pattern and is selected from the group consisting of parallel lines, parallel curves, parallel zigzag lines, and combinations thereof which do not meet each other. The interfaces between the first pattern and the second pattern form figures selected from the group consisting of polygons, circles, ellipses, and combinations thereof. The figures are repetitively formed on one or both surfaces of the plate. The 3-dimensional complex multilayer structure includes different complex patterns, whereas a conventional device has a kind of simple pattern. The 3-dimensional complex multilayer structure of the present invention can be manufactured by a simple process. Therefore, the 3-dimensional complex multilayer structure of the present …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.