Fingerprint sensor under thin face-sheet with aperture layer
US9959444B2 · kind B2 · utility
55Cited by
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25Claims
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Assignee
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Key dates
| Filing date | Sep 1, 2016 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Nov 25, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04103
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An input device for fingerprint sensing and proximity sensing includes a cover layer, where a top surface of the cover layer is configured to provide an input surface for a finger, a substrate having a cavity disposed below the cover layer, and a fingerprint sensor disposed below the cover layer and in the cavity of the substrate. A first adhesive layer is disposed between a top surface of the fingerprint sensor and a bottom surface of the cover layer in a fingerprint sensing area. A second adhesive layer is disposed between a top surface of the substrate and the bottom surface of the cover layer in a proximity sensing area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.