Reduction of dielectric losses through use of organoclay in semiconductor or insulator compositions
US9959951B2 · kind B2 · utility
1Cited by
3References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2008 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Aug 10, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B3/441
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Organodavs are added to semiconductive compositions to provide a reduction in the dielectric losses of layered composites in which the semiconductive layer contains species which could migrate into the insulation and result in undesirably high dielectric losses, The invention semiconductive compositions provide improved performance in power cable applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.