Method of forming body contact layouts for semiconductor structures
US9960236B2 · kind B2 · utility
2Cited by
11References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2016 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Nov 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for forming body contact layouts for semiconductor structures are disclosed. In at least one exemplary embodiment, a method comprises: forming a plurality of gates disposed on a semiconductor layer, each gate extending parallel to a y-axis in a coordinate space; a source region disposed between two of the plurality of gates; a plurality of body contacts disposed in each source region; and wherein a portion of each body contact, adjacent to the gate, has a width extending parallel to the y-axis that is less than the width of the body contact parallel to the y-axis at a distance on an x-axis from the gate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.