Solder joint material and method of manufacturing the same, soldering member and solar cell module
US9960289B2 · kind B2 · utility
0Cited by
3References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2014 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Sep 26, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1266
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder joint material includes a copper-based metal material including mainly a copper, a surface-treated layer that is provided on the copper-based metal material and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper, and a Sn-based solder plating layer provided on the surface-treated layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.