Intra-band combiner-divider and multisystem combining platform
US9960749B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | May 26, 2016 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | May 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H11/36
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present application provide an intra-band combiner-divider and a multisystem combining platform, and the intra-band combiner-divider includes: a first-level duplexer, an intra-band combination unit, an intra-band division unit, and a second-level duplexer. In the embodiments of the present application, two ends of the intra-band combiner-divider are connected to the first-level duplexer and the second-level duplexer, so that the intra-band combiner-divider can separately process uplink and downlink signals, thereby reducing PIM of a communication system and improving receiver sensitivity of a base station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.