Infrared focal plane array heat spreaders
US9961277B2 · kind B2 · utility
2Cited by
54References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2015 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Nov 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N25/21
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, an infrared (IR) sensor module includes an IR sensor assembly, including a substrate, a microbolometer array disposed on an upper surface of the substrate; and a cap disposed on the upper surface of the substrate and hermetically enclosing the microbolometer array. A base is disposed below the substrate, and a heat spreader having a generally planar portion is interposed between a lower surface of the substrate and an upper surface of the base. In some embodiments, the heat spreader can include a material having an anisotropic thermal conductivity, e.g., graphite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.