Patent · US Active

Method for producing an electronic assembly

US9961779B2 · kind B2 · utility

1Cited by

8References

9Claims

0Family size

Assignee

Continental Teves AG & Co. OHG · DE

Inventors

Lothar Biebricher · Oberursel, DE
Michael Schulmeister · Geiselhöring, DE
Jakob Schillinger · Gaimersheim, DE
Dietmar Huber · Annaberg-Buchholz, DE
Thomas H. Fischer · Wenden, DE
Stefan Günthner · Frankfurt am Main, DE
Waldemar Baumung · Pfungstadt, DE

Key dates

Filing date	Dec 10, 2013
Grant date	May 1, 2018
Priority date	—
Expiry date	Apr 9, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49147
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing an electronic assembly in which an electronic component supported on a wiring support is encapsulated with an encapsulation material, the method including: —arranging the electronic component on the wiring support in such a manner that a stress applied onto the electronic component by the encapsulation material falls below a predetermined value; and —encapsulating the electronic component with the encapsulation material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.