Apparatuses and systems for increasing thermal mass in line card heatsinks
US9961799B1 · kind B1 · utility
0Cited by
5References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2016 |
| Grant date | May 1, 2018 |
| Priority date | — |
| Expiry date | Aug 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B10/25
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosed apparatus may include (1) a faceplate that facilitates at least one connection between at least one communication cable and a line card that forwards traffic in connection with a network, (2) at least one heatsink that (A) is integrated into the faceplate and (B) absorbs heat dissipated by at least one electronic component included in the line card, and (3) at least one mount that (A) is integrated into the faceplate and (B) enables the electronic component to attach to the heatsink. Various other apparatuses and systems are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.