Patent · US Active

Curable thermosetting resin composition

US9963530B2 · kind B2 · utility

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11Claims

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Assignee

CHANGZHOU BAMSTONE COMPOSITES CO., LTD. · CN

Inventors

Wei Liu · Hangzhou City, CN
Ruimin Xiao · Changzhou City, CN
Lu Wang · Jingwei, CN

Key dates

Filing date	Sep 21, 2015
Grant date	May 8, 2018
Priority date	—
Expiry date	Sep 21, 2035

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2203/20
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A curable thermosetting resin composition, including a multicomponent copolymer and an epoxy resin. The multicomponent copolymer is a ternary or quaternary copolymer having structural units selected from the group consisting of unit (I), unit (II), unit (III) and (IV). The structural unit (I) isthe structural unit (II) isthe structural unit (III) isand the structural unit (IV) is

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.