Polyamide molding material and moldings manufactured from same
US9963591B2 · kind B2 · utility
17Cited by
78References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2013 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | Jul 20, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to heat-aging resistant polyamide molding materials based on partially crystalline, partially aromatic polyamides as well as to moldings manufactured therefrom.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.