Electrically conductive adhesives, assemblies including the electrically conductive adhesives, and related methods
US9963619B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 24, 2015 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | Apr 1, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An assembly comprising a first article, a second article adjacent the first article, and an electrically conductive adhesive in electrical communication with the first article and the second article. The electrically conductive adhesive comprises nickel nanostrands dispersed in a matrix comprising a reaction product of bisphenol-F epoxy resin, resorcinol diglycidyl ether epoxy monomer, and at least one amine-containing curing agent. The electrically conductive adhesive exhibits a tensile adhesion strength greater than about 5,000 psi and a volume resistivity less than about 0.01 Ω·cm. Electrically conductive adhesives including nickel nanostrands, precursor packages of the electrically conductive adhesive, related methods of forming the electrically conductive adhesive and an assembly including the electrically conductive adhesive are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.