Functionally graded material by in-situ gradient alloy sputter deposition management

US9963778B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Hans-Juergen Eickelmann · Mainz, DE
• Thorsten Muehge · Mainz, DE
• Erik Rueger · Mainz, DE
• Markus Schmidt · Seibersbach, DE

Key dates

• Filing date: May 7, 2015
• Grant date: May 8, 2018
• Expiry date: Apr 29, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J37/3473
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Embodiments relate to a sputter chamber comprising both a target surface and an anode surface. The sputter chamber has both an ingress and an egress to allow passage of a gas. The sputter chamber further includes a target substrate. A secondary material flexibly changes the composition of the target substrate in-situ by changing coverage of the target by the secondary material. Gas entering the sputter chamber interacts with the changed composition of the target. The interaction discharges a plasma alloy and the alloy condenses on the anode surface in the sputter chamber. The condensed alloy produces an alloy film.