Light pipe heat sink element
US9964297B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 7, 2016 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | Nov 5, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An assembly for use with a heat producing electronic device is disclosed. The assembly may include a heat sink in thermally conductive contact with a shell containing the electronic device, and a light pipe having a first thermal conductivity and configured to transmit light from a light-emitting diode (LED) to a front side of the heat sink. The light pipe may include at least a portion having a thermally conductive layer with a second thermal conductivity greater than the first thermal conductivity. The thermally conductive layer may cover at least a portion of an outer surface of the light pipe, and be positioned between, and in thermally conductive contact with a portion of the heat sink protrusions. The thermally conductive layer may be designed to conduct and radiate heat away from at least a portion of the heat sink protrusions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.