Sensor module and method of manufacture
US9964606B2 · kind B2 · utility
1Cited by
3References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 28, 2017 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | Apr 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N50/01
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
According to embodiments there is provided a magneto-resistive sensor module. The sensor module may comprise: an integrated circuit; magneto-resistive sensor elements arranged as a bridge circuit monolithically integrated on the integrated circuit; and a stress buffer layer arranged between the integrated circuit and the magneto-resistive sensor element. There is also a provided a method of manufacturing the magneto-resistive sensor module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.