Patent · US Active

Low footprint optical interconnects

US9964716B1 · kind B1 · utility

0Cited by
29References
8Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 11, 2015
Grant dateMay 8, 2018
Priority date—
Expiry dateSep 11, 2035

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49144
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Compact ASIC, chip-on-board, flip-chip, interposer, and related packaging techniques are incorporated to minimize the footprint of optoelectronic interconnect devices, including the Optical Data Pipe. In addition, ruggedized packaging techniques are incorporated to increase the durability and application space for optoelectronic interconnect devices, including an Optical Data Pipe.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.