Void evaluation apparatus and void evaluation method in the solder
US9965849B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 10, 2014 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | Feb 10, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A void evaluation apparatus in a solder includes an evaluation function calculation unit for calculating a solder evaluation function by using a pixel value pi contained in the voids that is set to 1 and the pixel value pi not contained in the voids is 0 for each pixel constituting an image in the solder, and by using a weight function w(ri), which is maximum at a solder center (ri=0), and is 0 at a maximum radius (ri=r0) for a distance ri from the solder center. The apparatus further has a void evaluation unit for evaluating that the influence of voids is larger as the evaluation function is relatively larger for the each solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.