Method for producing optoelectronic semiconductor devices
US9966370B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2014 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | Oct 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing a plurality of optoelectronic semiconductor devices is provided. A number of semiconductor chips are fastened on an auxiliary support. The semiconductor chips are spaced apart from one another in a lateral direction. A reflective layer is formed, at least in regions between the semiconductor chips. A composite package body is formed at least in certain regions between the semiconductor chips. The auxiliary support is removed and the composite housing body is separated into a number of optoelectronic semiconductor devices. Each optoelectronic semiconductor device has at least one semiconductor chip, part of the reflective layer and part of the composite package body as a package body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.