Patent · US Active

Method for producing optoelectronic semiconductor devices

US9966370B2 · kind B2 · utility

3Cited by
4References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 23, 2014
Grant dateMay 8, 2018
Priority date
Expiry dateOct 23, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/853
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for producing a plurality of optoelectronic semiconductor devices is provided. A number of semiconductor chips are fastened on an auxiliary support. The semiconductor chips are spaced apart from one another in a lateral direction. A reflective layer is formed, at least in regions between the semiconductor chips. A composite package body is formed at least in certain regions between the semiconductor chips. The auxiliary support is removed and the composite housing body is separated into a number of optoelectronic semiconductor devices. Each optoelectronic semiconductor device has at least one semiconductor chip, part of the reflective layer and part of the composite package body as a package body.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.