Method for manufacturing light-emitting element
US9966498B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2016 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | May 9, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0363
Abstract
A method for manufacturing a light-emitting element, including steps of: providing a wafer-level element including a wafer and a light-emitting stack on the wafer, wherein the wafer including an upper surface and a bottom surface, and light-emitting stack is formed on the upper surface of the wafer; forming a light-emitting stack on the upper surface of the wafer; cutting the wafer from one of the bottom surface or the top surface of the wafer by a water-jet laser having a first beam size; cutting the wafer from the other one of the bottom surface or the upper surface of the wafer by the water-jet laser having a second beam size; and dividing the wafer-level element wafer and the light-emitting stack into a plurality of light-emitting dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.