Wafer level optics for folded optic passive depth sensing system
US9967547B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2017 |
| Grant date | May 8, 2018 |
| Priority date | — |
| Expiry date | Apr 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N99/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Certain aspects relate to wafer level optical designs for a folded optic stereoscopic imaging system. One example folded optical path includes first and second reflective surfaces defining first, second, and third optical axes, and where the first reflective surface redirects light from the first optical axis to the second optical axis and where the second reflective surface redirects light from the second optical axis to the third optical axis. Such an example folded optical path further includes wafer-level optical stacks providing ten lens surfaces distributed along the first and second optical axes. A variation on the example folded optical path includes a prism having the first reflective surface, wherein plastic lenses are formed in or secured to the input and output surfaces of the prism in place of two of the wafer-level optical stacks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.