Printed circuit board design and manufacturing
US9971338B1 · kind B1 · utility
3Cited by
2References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2017 |
| Grant date | May 15, 2018 |
| Priority date | — |
| Expiry date | Mar 31, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A spatial model of a printed circuit board assembly is generated based on an input file. The spatial model is used to determine a spatial feature not directly specified in the input file. A manufacturing parameter is determined based at least in part on the determined spatial feature. A proposal to manufacture the printed circuit board assembly is generated programmatically based at least in part on the determined manufacturing parameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.