Microwave integrated quantum circuits with VIAS and methods for making the same
US9971970B1 · kind B1 · utility
55Cited by
30References
77Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 27, 2016 |
| Grant date | May 15, 2018 |
| Priority date | — |
| Expiry date | Apr 27, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/933
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A quantum computing system includes a quantum circuit device, a substrate having a first surface on which the quantum processing device is disposed, and one or more vias each extending through the substrate. The vias include a material that is a superconducting material during operation of the quantum computing system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.