Metal particle dispersion for electroconductive substrates, method for producing the same, and method for producing an electroconductive substrate
US9972413B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2013 |
| Grant date | May 15, 2018 |
| Priority date | — |
| Expiry date | May 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1168
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is to provide a metal particle dispersion for electroconductive substrates, which has high dispersibility and dispersion stability and which is able to form a film that shows high electroconductivity after baking. Disclosed is a metal particle dispersion for electroconductive substrates, comprising metal particles, a dispersant and a solvent, wherein the dispersant is a graft copolymer having at least a constitutional unit represented by the following chemical formula (I) and a constitutional unit represented by the following chemical formula (II):(Symbols in the formulae are as described in the Description.)
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.