EMI absorber ring
US9972577B1 · kind B1 · utility
1Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2016 |
| Grant date | May 15, 2018 |
| Priority date | — |
| Expiry date | Aug 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electromagnetic interference absorber for an integrated circuit is provided. The absorber includes a geometric ring of electromagnetic energy absorbing material, dimensioned to fit over a ball grid array (BGA) integrated circuit package assembled to a substrate. The geometric ring has at least one projection arranged to fit into a gap between the substrate and a body of the BGA integrated circuit package so as to retain the geometric ring to the BGA integrated circuit package. Methods to contain electromagnetic interference and to manufacture an electromagnetic interference absorber are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.