Monolithic interconnection for solar cells

US9972733B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Hans-Juergen Eickelmann · Mainz, DE
• Ruediger Kellmann · Mainz, DE
• Markus Schmidt · Seibersbach, DE

Key dates

• Filing date: Aug 2, 2016
• Grant date: May 15, 2018
• Expiry date: Aug 2, 2036

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50

Abstract

A method for fabricating a solar cell includes providing a first substrate with at least one protruding element on the first substrate. The method removes a portion of a lower conducting layer located on the first substrate, wherein the removed portion of the lower conducting layer is located near the at least one protruding element. The method removes a first portion of an active layer located on the lower conducting layer. The method deposits an upper conducting layer on the active layer, wherein the conducting layer covers the at least one protruding element. The method removes a portion of the upper conducting layer, wherein the removed portion of the upper conducting is located near the at least one protruding element.