Circuit board and method for fabricating the same
US9974171B2 · kind B2 · utility
0Cited by
35References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2015 |
| Grant date | May 15, 2018 |
| Priority date | — |
| Expiry date | Nov 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1147
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.