Patent · US Active

Method and system of producing a multilayer element and multilayer element

US9974189B2 · kind B2 · utility

0Cited by

1References

19Claims

0Family size

Assignee

3D-Micromac AG · DE

Inventors

Frank Allenstein · Chemnitz, DE
Maurice Clair · Plauen, DE
Tino Petsch · Chemnitz, DE
Rocco Kundt · Neuss, DE

Key dates

Filing date	Aug 8, 2014
Grant date	May 15, 2018
Priority date	—
Expiry date	Aug 8, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1545
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method of producing a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material present in accordance with a prescribed pattern, electrically non-conductive second regions lying between the first regions to produce RFID antennas or flexible printed circuit boards in a roller-to-roller process, the method including connecting a conductor foil to the substrate by a laterally structured layer of adhesive lying in between such that in first regions a partial bonding contact between the substrate and the conductor foil is created at a multiplicity of bonding zones, and in laterally extended second regions the conductor foil is not connected or is connected less firmly by adhesive to the substrate; structuring the conductor foil by cutting the conductor foil along boundaries of the first regions; and removing contiguous pieces of foil of the conductor foil from laterally extended second regions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.