Alternative ground lines for inter-slot grounding
US9975335B2 · kind B2 · utility
0Cited by
8References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 18, 2014 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | Aug 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L24/06
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an example implementation, a grounding structure includes a perimeter ground line around the perimeter of a printhead die, and having north, south, east, and west segments. The structure includes an inter-slot ground line extending from the north segment to the south segment between two fluid slots, and an alternative ground line extending from the east segment to the west segment and intersecting the inter-slot ground line in a connection area near ends of the fluid slots.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.