Method of manufacturing a plurality of through-holes in a layer of first material
US9975761B2 · kind B2 · utility
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2References
9Claims
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Key dates
| Filing date | Feb 27, 2017 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | Feb 27, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0198
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method of manufacturing a plurality of through-holes in a layer of first material, for example for the manufacturing of a probe comprising a tip containing a channel. To manufacture the through-holes in a batch process,
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.