MEMS-based method for manufacturing sensor
US9975766B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 5, 2015 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | May 5, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0142
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An MEMS-based method for manufacturing a sensor comprises the steps of: forming a shallow channel (120) and a support beam (140) on a front surface of a substrate (100); forming a first epitaxial layer (200) on the front surface of the substrate (100) to seal the shallow channel (120); forming a suspended mesh structure (160) below the first epitaxial layer (200); and forming a deep channel (180) at a position on a back surface of the substrate (100) corresponding to the shallow channel (120), so that the shallow channel (120) is in communication with the deep channel (180). In the Method of manufacturing a MEMS-based sensor, when a shallow channel is formed on a front surface, a support beam of a mass block is formed, so the etching of a channel is easier to control, the process is more precise, and the uniformity and the homogeneity of the formed support beam are better.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.