Method for bonding substrates to cold and damp surfaces

US9976060B2 · kind B2 · utility

Assignee

• BASF SE

Inventors

• Joerg-Alexander DIMMER · Mannheim, DE
• Michael B. Gross · Kassel, DE
• Gledison Fonseca · Ludwigshafen, DE
• Miriam Mueller · Blieskastel, DE
• Anja Hubert · Ludwigshafen, DE

Key dates

• Filing date: Jun 15, 2015
• Grant date: May 22, 2018
• Expiry date: Jun 15, 2035

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C09J2433/00
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A description is given of a method, and of pressure-sensitive adhesive compositions suitable therefor, for bonding a substrate to cold and damp surfaces, the surface temperature being lower than the dewpoint temperature of the air in contact with the surface, and the pressure-sensitive adhesive composition comprising a pressure-sensitive adhesive polymer formed from defined amounts of 2-ethylhexyl acrylate, monomers selected from C1 to C2 alkyl (meth)acrylates, styrene, acid monomers, and optionally further monomers, in the presence of chain transfer agents.