Energy efficiency aware thermal management in a multi-processor system on a chip
US9977439B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2014 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | Nov 26, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D30/50
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.