Wafer pick-and-place method and system
US9978631B2 · kind B2 · utility
2Cited by
4References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 30, 2016 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | Jan 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer pick-and-place method and system is provided. During the wafer pick-and-place operation, the distance between the fork of the robot and the target wafer is detected to determine whether the robot will collide with the target wafer. Furthermore, the tilted angle of the target wafer relative to the fork is calculated to determine whether the wafer will slip off. If collision or wafer slippery may occur, the pick-and-place operation is stopped. Therefore, wafer damages due to unexpected contact between the fork and the wafer can be avoided, and wafer handling safety can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.