Sub-terahertz/terahertz interconnect

US9978676B2 · kind B2 · utility

Assignee

• The Regents of the University of California · US

Inventors

• Qun Gu · San Jose, US
• Xiaoguang Liu · West Lafayette, US
• Neville C. Luhmann, Jr. · Walnut Creek, US
• Bo Yu · Singapore, SG

Key dates

• Filing date: May 27, 2016
• Grant date: May 22, 2018
• Expiry date: Jul 8, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An interconnect is described that comprises an interconnect channel, and two channel couplers coupled to the two ends of the interconnect channel through respective stoppers that provide a gap between the channel couplers and the interconnect channel. Each channel coupler can comprise a coplanar waveguide, a microstrip line, and a patch-antenna based coupler. The interconnect can enable communication between integrated circuits using signal waves having a frequency between 100 GHz and 3 THz.