Network with integrated passive device and conductive trace in packaging substrate and related modules and devices
US9978732B2 · kind B2 · utility
13Cited by
4References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2015 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | Oct 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment, an apparatus includes a packaging substrate and a die on the packaging substrate. The die includes an integrated passive device and a contact providing an electrical connection to the integrated passive device. A conductive trace of the packaging substrate is in an electrical path between the contact of the die and a ground potential. Such an integrated passive device and conductive trace can be included in a matching network configured to receive an amplified radio frequency signal from a power amplifier, for example. The packaging substrate can be, for example, a laminate substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.