Encapsulant bonding methods for photovoltaic module manufacturing
US9978896B2 · kind B2 · utility
2Cited by
2References
8Claims
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Key dates
| Filing date | Sep 15, 2015 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | Sep 15, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Various improved approaches to prevent solar cell motion during manufacturing of PV laminates and modules are described herein. Disclosed contactless heating methods comprise positioning a plurality of solar cells on a layer of encapsulant and heating an encapsulant bonding region within the first encapsulant layer to a temperature sufficient to adhere the plurality of solar cells to the superstrate. Compared to some heat-tacking methods and manual taping, the contactless heating methods described herein provide an accurate, high-throughput approach to inhibiting solar cell shifting during PV module manufacture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.