Flexible printed circuit board and method for manufacturing the same
US9980386B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 26, 2017 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | Oct 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09509
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a flexible printed circuit board includes providing a first double-sided circuit substrate which comprises an electronic component. A multilayer circuit substrate having a mounting groove is also provided. The multilayer circuit substrate covers the first double-sided circuit substrate through an adhesive layer, causing the electronic component to be received in the mounting groove, thereby forming an intermediate product. At least one through hole is defined in the intermediate product, which when filled with conductive material electrically connects the multilayer circuit substrate to the first double-sided circuit substrate to form the flexible printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.