Process for producing substrate having wiring, radiation-sensitive composition, electronic circuit and electronic device
US9980392B2 · kind B2 · utility
0Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2016 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | Sep 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/1258
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A process for producing a substrate having wiring includes steps (i) to (v) described as follows: (i) applying a radiation-sensitive composition on a substrate to form a coating film; (ii) irradiating a prescribed part of the coating film with radiation to allow the coating film to have a radiation-irradiated region and a radiation-unirradiated region; (iii) allowing the coating film obtained in the step (ii) to have a concave region and a convex region; (iv) forming wiring on the concave region; and (v) removing the convex region by an application of radiation or by heating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.