Low profile magnetic component apparatus and methods
US9980396B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2011 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | Apr 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2027/297
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A magnetic component for an electronic circuit includes a core having a core body and a core leg extending from the core body. The core body defines a core body height, and the core leg defines a core leg height less than the core body height. A conductive winding is positioned about the core leg. The winding defines a winding height. A winding height offset ratio is defined as the winding height divided by the core body height. In some embodiments the winding height offset ratio is less than about 1.1. The winding can be positioned on a bobbin structure disposed about the core leg. The magnetic component can be positioned in an enclosure to form an electronic device such as a power control or a power supply, and a thermally conductive gap-filler can be positioned between the magnetic component and the enclosure wall to dissipate heat from the magnetic component. The reduced height of the core leg provides a reduced gap distance between the core body and the enclosure wall for improving heat transfer, reducing thermal gap-filler material volume and reducing enclosure size. A method of forming an electronic device is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.