Configurable double-sided modular jet impingement assemblies for electronics cooling
US9980415B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2015 |
| Grant date | May 22, 2018 |
| Priority date | — |
| Expiry date | Dec 24, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20927
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and a modular manifold having a first distribution recess extending into a first side of the modular manifold, a second distribution recess extending into a second side of the modular manifold, a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, and a plurality of outlet connection tubes positioned at an outlet end of the modular manifold. A first manifold insert is removably positioned within the first distribution recess, a second manifold insert is removably positioned within the second distribution recess, and a first and second heat transfer plate each removably coupled to the modular manifold. The first and second heat transfer plates each comprise an impingement surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.