Patent · US Active

Configurable double-sided modular jet impingement assemblies for electronics cooling

US9980415B2 · kind B2 · utility

30Cited by
31References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 20, 2015
Grant dateMay 22, 2018
Priority date
Expiry dateDec 24, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K7/20927
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and a modular manifold having a first distribution recess extending into a first side of the modular manifold, a second distribution recess extending into a second side of the modular manifold, a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, and a plurality of outlet connection tubes positioned at an outlet end of the modular manifold. A first manifold insert is removably positioned within the first distribution recess, a second manifold insert is removably positioned within the second distribution recess, and a first and second heat transfer plate each removably coupled to the modular manifold. The first and second heat transfer plates each comprise an impingement surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.