Indium-tin-silver based lead free solder
US9981347B2 · kind B2 · utility
3Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 2016 |
| Grant date | May 29, 2018 |
| Priority date | — |
| Expiry date | May 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3457
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Indium-tin-silver alloys suitable for use as a lead free solder are described herein. The alloys may comprise primarily indium or comprise primarily tin. The alloys may further include copper, nickel, and iron or copper, antimony, and zinc. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component. Methods of forming the alloys are also described herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.